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X-WR-CALDESC:Events for Heilind Electronics - Connectors, Electromechanical & Sensors
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DTSTART;VALUE=DATE:20241101
DTEND;VALUE=DATE:20241102
DTSTAMP:20260524T095721
CREATED:20250918T131355Z
LAST-MODIFIED:20260422T205139Z
UID:14487-1730419200-1730505599@development.heilind.com
SUMMARY:Reduce the Risk of Equipment Failure with Efficient Wire Termination Solutions
DESCRIPTION:When designing an electrical system\, reducing the risk of failure is a top priority. By making the best selections and ensuring proper installations of the termination\, you can be sure your end product will meet industry standards. \nIn this Webinar\, you will learn about the efficient process to properly crimp and install connections to help meet the needs of your application. The presentation will also discuss tips on what to look for to ensure quality performance and reliability while reducing service work. \nSpeakers: \n\nVince Barone\, Product Strategy Manager at Panduit Corporation\nBrendan Haas\, Product Manager of Terminals\, Reelsmart\, and Wiring Duct products at Panduit Corporation
URL:https://development.heilind.com/cms/event/reduce-the-risk-of-equipment-failure-with-efficient-wire-termination-solutions/
LOCATION:MI
CATEGORIES:Webinars
ATTACH;FMTTYPE=image/jpeg:https://development.heilind.com/cms/wp-content/uploads/panduit-webpage-banner_1.jpg
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DTSTART;VALUE=DATE:20241001
DTEND;VALUE=DATE:20241002
DTSTAMP:20260524T095721
CREATED:20250918T131438Z
LAST-MODIFIED:20260422T205139Z
UID:14490-1727740800-1727827199@development.heilind.com
SUMMARY:Optimized Interconnect Solutions for Design Flexibility in Portable Devices
DESCRIPTION:If you are an engineer or commodity manager looking to learn more about emerging technologies for portable devices\, be sure to register for this informative on-demand session. \nJoin our speaker\, Kenta Minejima\, as he dives into an in-depth overview of the emerging USB Type-C connector and cable standard\, providing insights on the different requirements supported – including levels of power\, data\, and video\, the various design advantages\, and the different connector and cable options for each application. He will also provide information on compact FPC connectors that can be used as an additional internal interconnect between the external I/O and main board for compact device designs. Many times an extra internal interconnect is necessary between the external I/O and the main board when all components cannot be mounted on the main board\, due to the shape of the device housing or varying heights of components mounted on the board. Learn how new compact FPC connectors can help solve this issue while providing up to 10A power for fast charging. \nAttend this webinar and learn: \n\nThe USB Type-C industry standard and the advantages it provides\nUSB Type-C connector and cable variations commonly available and how to best implement them\nHow to use Board to FPC connectors for internal power and data transmission to maximize design flexibility\n\nSpeaker: Kente Minejima\, Marketing Manager\, JAE Electronics
URL:https://development.heilind.com/cms/event/optimized-interconnect-solutions-for-design-flexibility-in-portable-devices/
LOCATION:MI
CATEGORIES:Webinars
ATTACH;FMTTYPE=image/jpeg:https://development.heilind.com/cms/wp-content/uploads/jae-ondemand-webinar.jpg
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20240901
DTEND;VALUE=DATE:20240902
DTSTAMP:20260524T095721
CREATED:20250918T131542Z
LAST-MODIFIED:20260422T205139Z
UID:14493-1725148800-1725235199@development.heilind.com
SUMMARY:New Power Technologies Reduce Failures\, Improve Reliability
DESCRIPTION:Molex technical power experts will discuss three separate technologies that apply to power distribution\, and how these solutions are reducing failures and improving reliability in the field. \n\nPower-application customers face the tasks of choosing headers with exposed terminals that could leave connectors susceptible to damage\, and large\, fully isolated headers that take up too much space. We will discuss how innovative power connectors help solve this dilemma by providing design engineers with fully protected header terminals in a small package. Topics covered include a technology overview and applications.\nWhen mating two rigid PCBs or bus bars\, it is difficult to have perfect pin-to-socket alignment. A degree of float is needed in these situations to accommodate any misalignment there may be. A new interconnect system provides up to 1.0mm of float (industry leading) through its unique design. This float assures ease of mating and prevents potential damage to the socket contacts.\nWe will review laminated busbar applications and how of custom power distribution solutions can be utilized.\n\nSpeakers: \n\nTrent Perkins\, Group Product Manager\, Molex\nJeff Gaumer\, New Product Development Manager\, Molex\nRalph Kern\, Business Development Manager – Triton
URL:https://development.heilind.com/cms/event/new-power-technologies-reduce-failures-improve-reliability/
LOCATION:MI
CATEGORIES:Webinars
ATTACH;FMTTYPE=image/jpeg:https://development.heilind.com/cms/wp-content/uploads/molex-ondemand-webinar.jpg
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20240801
DTEND;VALUE=DATE:20240802
DTSTAMP:20260524T095721
CREATED:20250918T131656Z
LAST-MODIFIED:20260422T205139Z
UID:14496-1722470400-1722556799@development.heilind.com
SUMMARY:How Unique Cable & Connector Solutions Are Taking 3D Printing to New Level
DESCRIPTION:In today’s fast paced\, quick development cycle market-places\, the need for rapid prototyping and quick turn sampling is critical. 3D printing\, and additive manufacturing has quickly surfaced as the solution for this need\, bringing to life ideas and concepts in minutes\, instead of months. Tyler Madden\, Global Product Manager for Data and Devices at TE Connectivity\, will discuss how Heilind Electronics and TE Connectivity’s cable and connector systems can enable 3D printing\, as we dive into product based solutions that can enable your 3D printer designs. \nIn the second half of this webinar\, we will take a closer look at challenges faced today and how TE’s discrete wire interconnect solutions consisting of CT\, Mini CT and HPI can help. We will also review new innovative products that can provide space savings\, and unique cable routing solutions\, to take your designs to new levels! Speaker: Tyler Madden\, Global Product Manager – Data & Devices Business Unit\, TE Connectivity
URL:https://development.heilind.com/cms/event/how-unique-cable-connector-solutions-are-taking-3d-printing-to-new-level/
LOCATION:MI
CATEGORIES:Webinars
ATTACH;FMTTYPE=image/jpeg:https://development.heilind.com/cms/wp-content/uploads/te-ondemand-webinar.jpg
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