Molex technical power experts will discuss three separate technologies that apply to power distribution, and how these solutions are reducing failures and improving reliability in the field.

1. Power-application customers face the tasks of choosing headers with exposed terminals that could leave connectors susceptible to damage, and large, fully isolated headers that take up too much space. We will discuss how innovative power connectors help solve this dilemma by providing design engineers with fully protected header terminals in a small package. Topics covered include a technology overview and applications.
2. When mating two rigid PCBs or bus bars, it is difficult to have perfect pin-to-socket alignment. A degree of float is needed in these situations to accommodate any misalignment there may be. A new interconnect system provides up to 1.0mm of float (industry leading) through its unique design. This float assures ease of mating and prevents potential damage to the socket contacts.
3. We will review laminated busbar applications and how of custom power distribution solutions can be utilized.

Speakers:

• Trent Perkins, Group Product Manager, Molex
• Jeff Gaumer, New Product Development Manager, Molex
• Ralph Kern, Business Development Manager – Triton